PCB Manufacturing
PCB Projects
HDI board
Layers: 20
Material: FR-4 EM370
Surface Finish: Hard Gold
Board Thickness: 5.5mm
Minimum Hole: 0.25mm
Line Width & Space: 3 / 3mil
Special Technology: 4-step HDI, Hard Gold thickness 30U"
High Speed Board
Layers: 24
Material: FR-4 Panasonic M6
Surface Finish:ENIG
Board Thickness: 3mm
Minimum Hole: 0.25mm
Line Width Space: 3.5 / 3.5mil
Special Technology: Via in PAD, Back drilling, Depth milling, Impedance
High Frequency Board
Layers: 2
Material: Rogers 5880
Surface Finish: ENIG+Hard Gold
Board Thickness: 0.15mm
Minimum hole: 0.25mm
Line Width & Space: 6 / 6mil
Special Technology: Hard Gold thickness is 120 micro inches
Hybrid Board
Layers: 3
Material: F4BME+Rogers 4450
Surface Finish: ENIG
Board Thickness: 3.2mm
Minimum Hole: 0.3mm
Line Width & Space: 5 / 5mil
Special Technology: Hybrid, Step board, Half hole, Edge plating, Depth Milling
Flex-rigid
Layers: 4
Meterial: FR-4+SF202
Surface Finish: ENIG
Board Thickness: 1mm
Minimum hole: 0.2mm
Line Width & Space: 4 / 4mil
Special Technology: Flex-rigid, edge plating
HDI Board
Layers: 3
Material: Rogers4350+ Metal Base
Surface Finish: ENIG+Hard Gold
Board Thickness: 1.6mm
Minimum Hole: 0.25mm
Line Width & Space: 5 / 5mil
Special Technology: Metal Base, 2 StepHDI, Impedance, Depth Milling